Benachrichtigungen:
Erklärungen:

Technische Parameter von Leiterplatten (TS PCB):
Technische Parameter von Leiterplatten (TS PCB)

Declarations and certifications:
ISO 9001:2015 ISO 14001:2015 Certificate
Declaration of Conformity – RoHS, WEE, ELV, REACH
UL Certificate

Technische Spezifikation von Basismaterialien:
FR4 – ISOLA IS400 (TG 150º C)
FR4 – ISOLA IS410 (TG 180º C)
FR4 – NAN YA FR-4-86
FR4 – NAN YA FR-4-86PY (CTI >600 V)
FR4 – NAN YA NP 140 TL (cores) + NP 140 B (prepregs)
FR4 – ILM U1 (multilayer PCBs)
FR4 – ILM R1 (1-layer and 2-layer PCBs)
Mikrowellen – Rogers RO3000
Mikrowellen – Rogers RO4000
Mikrowellen – Rogers RT/duroid®5870 /5880
MCPCB (ALU) – Polytherm-H TC-Lam 1.8-2.0

Lötstoplack- und Positionsdruck-Spezifikation:
Lötstoplack (standard) – Peters Elpemer 2467 ( curtain coating: green, semi mat)
Lötstoplack (photoimageable) und Positionsdruck – Peters SD 24XX
Peelable Lötstoplack – Peters SD 2955

Standard stackups of the multilayers PCBs

4-layers PCBs:
Buildup for 0.55 mm 4 ML PCB (tol. +/- 10%)
Buildup for 0.80 mm 4 ML PCB (tol. +/- 10%)
Buildup for 1.00 mm 4 ML PCB (4-layer TSka, tol. +/- 10%)
Buildup for 1.55 mm 4 ML PCB (4-layer TSka, tol. +/- 10%)
Buildup for 2.00 mm 4 ML PCB (tol. +/- 10%)
Buildup for 2.40 mm 4 ML PCB (tol. +/- 10%)

6-layers PCBs:
Buildup for 1.00 mm 6 ML PCB (tol. +/- 10%)
Buildup for 1.55 mm 6 ML PCB (tol. +/- 10%)
Buildup for 2.00 mm 6 ML PCB (tol. +/- 10%)
Buildup for 2.40 mm 6 ML PCBm (tol. +/- 10%)

8-layers PCBs:
Buildup for 1.55 mm 8 ML PCB (tol. +/- 10%)

Other documents:
Technological sheet