Notifications:
Statements:

Processing parameters of PCBs in TS PCB:
Processing parameters of PCBs in TS PCB

Declarations and certifications:
ISO 9001:2015 ISO 14001:2015 Certificate
Declaration of Conformity – RoHS, WEE, ELV, REACH
UL Certificate

Specifications of the laminates:
FR4 – ISOLA IS400 (TG 150º C)
FR4 – ISOLA IS410 (TG 180º C)
FR4 – NAN YA FR-4-86
FR4 – NAN YA FR-4-86PY (CTI >600 V)
FR4 – NAN YA NP 140 TL (cores) + NP 140 B (prepregs)
FR4 – ILM U1 (multilayers PCBs)
FR4 – ILM R1 (1-layer PCBs and 2-layer PCBs)
Microwaves – Rogers RO3000
Microwaves – Rogers RO4000
Microwaves – Rogers RT/duroid®5870 /5880
MCPCB (ALU) – Polytherm-H TC-Lam 1.8-2.0

Specifications of the soldermasks and marking inks:
Soldermask (standard) – Peters Elpemer 2467 ( curtain coating: green, semi mat)
Soldermasks (photoimageable) and marking inks – Peters SD 24XX
Peelable solder masks – Peters SD 2955

Standard stackups of the multilayers PCBs

4-layers PCBs:
Buildup for 0.55 mm 4 ML PCB (tol. +/- 10%)
Buildup for 0.80 mm 4 ML PCB (tol. +/- 10%)
Buildup for 1.00 mm 4 ML PCB (4-layer TSka, tol. +/- 10%)
Buildup for 1.55 mm 4 ML PCB (4-layer TSka, tol. +/- 10%)
Buildup for 2.00 mm 4 ML PCB (tol. +/- 10%)
Buildup for 2.40 mm 4 ML PCB (tol. +/- 10%)

6-layers PCBs:
Buildup for 1.00 mm 6 ML PCB (tol. +/- 10%)
Buildup for 1.55 mm 6 ML PCB (tol. +/- 10%)
Buildup for 2.00 mm 6 ML PCB (tol. +/- 10%)
Buildup for 2.40 mm 6 ML PCBm (tol. +/- 10%)

8-layers PCBs:
Buildup for 1.55 mm 8 ML PCB (tol. +/- 10%)

Other documents:
Technological sheet